| Number
of layers |
1-14 layers |
| Bare
material |
FR4¡¢FR1¡¢CEM1¡¢CEM3¡¢PTFE¡¢aluminum |
| |
|
inch |
mm |
| Panel
size (max.) |
1
to 2 layers |
17
x 23 |
431.8
x 584.2 |
| 3 to 14 layers |
17 x 23 |
431.8 x 584.2 |
| Board
Thickness |
1
to 2 layers |
0.008
- 0.126 |
0.20
- 3.20 |
| 3 to 4 layers |
0.020 - 0.126 |
0.50 - 3.20 |
| 5
to 6 layers |
0.033
- 0.126 |
0.83
- 3.20 |
| 7 to 8 layers |
0.043 - 0.126 |
1.10 - 3.20 |
| 9
to 10 layers |
0.054
- 0.126 |
1.38
- 3.20 |
| 11 to 12 layers |
0.065 - 0.126 |
1.65 - 3.20 |
| 13
to 14 layers |
0.076
- 0.126 |
1.93
- 3.20 |
| Core |
0.004 - 0.039 |
0.10 - 1.0 |
| Min.
isolation thickness |
Min. |
0.004 |
0.10 |
| Min.
conductor width/space |
Inner-layers 18um |
0.0030/0.0030 |
0.075/0.075 |
| ¡¡¡¡¡¡¡¡¡¡¡¡35um |
0.0040/0.0040 |
0.100/0.100 |
¡¡¡¡¡¡¡¡¡¡¡¡70um |
0.0059/0.0059 |
0.150/0.150 |
| Outer-layers
18um |
0.0040/0.0040 |
0.100/0.100 |
| ¡¡¡¡¡¡¡¡¡¡¡¡35um |
0.0059/0.0059 |
0.150/0.150 |
|
¡¡¡¡¡¡¡¡¡¡¡¡70um |
0.0079/0.0079 |
0.200/0.200 |
| ¡¡¡¡¡¡¡¡¡¡¡¡105um |
0.0118/0.0118 |
0.300/0.300 |
| Smallest
hole-diameter |
Via |
0.0079 |
0.200 |
| Component hole |
0.0160 |
0.400 |
| Warp
and twist |
<=0.8% |
Blind
& buried hole |
Non-buildup Process |
| Plating
copper thickness |
Copper>=
25um |
| Coating |
Solder resist |
Thickness: 15-25um or according to requests
of customer
Clearance: 0.05mm (0.002in)
Color: green¡¢blue£»Other colors need to be special mentioned. |
| Peelable
resist |
Thickness: >=0.15mm
Color: green¡¢blue and bright blue£»Other colors need to
be special mentioned. |
| Routing |
tolerance |
+/-0.004 |
+/-0.10 |
| Scoring |
Angle:
15¡ã¡¢30¡ã¡¢60¡ã |
| Residue thickness tolerance |
¡À0.0039"
£¨thickness¡Ý0.0315"£© |
¡À0.1mm
(thickness¡Ý0.8mm) |
| BBT |
Test voltage can reach
250v
Test current can reach 20mA
Min.isolation resistance in isolation test¨C 10M ohms
Test grid ¨C 1/2 grid (1.27mm)
Min. pitch ¨C 0.50mm |
| Surface
technology |
¡¡¡¡HAL ¡¡¡¡¡¡normal thickness: >=2um |
| ¡¡¡¡Gold finger/select
plating gold¡¡¡¡¡¡Ni: 4-6um Au: 0.5-5um |
| ¡¡¡¡Chem. Ni/Au¡¡¡¡¡¡Ni: 3-6um (or over) Au:
0.05-0.10um (or over) |
| ¡¡¡¡ENTEK |
| ¡¡¡¡Chem.silver |
| ¡¡¡¡Flash gold plating
|
| ¡¡¡¡Solder resist |
| ¡¡¡¡Carbon ink¡¡¡¡¡¡min. clearance:
0.25mm |
| ¡¡¡¡Peelable resist |
| ¡¡¡¡Via plug¡¡¡¡¡¡¡¡¡¡¡¡¡¡extent:
30-100% ¡¡¡¡diameter:0.2mm |
| Legend
printing |
Color: white¡¢yellow
Positional tolerance: +/-0.15mm
Min. Legend trace width=0.15mm
Min. Legend height=0.8mm |
| Acceptable
files/data |
Pattern |
Gerber 274x(preferred),
DPF, MDA, Gerber D, Protel99se,DXF, IPC-D-350 |
| Drill |
Excellon1/ Excellon2
Sieb&Meyer 1000
Sieb&Meyer 3000 |
| Drawing |
DXF, HPGL, Gerber,Autocad
R14,PDF,DPF,
Tiff,JPG, BMP, Gif ,CAM350, Autocad 2000 |